Joseph Allen Eckstein, Sunman, IN; Hailing Bao, Blue Ash, OH; Robert Charles Dreisig, West Chester, OH; Howard Jay Kalnitz, Cincinnati, OH; and Uwe Schneider, Cincinnati, OH.
Assigned to The Procter & Gamble Company, Cincinnati, OH.

Filed: 4/9/18
Issued: 1/28/20

An apparatus for dynamically bonding substrates, the apparatus comprising: an anvil roll; a bonding roll including: a base circumferential surface; a pattern element, wherein the pattern element includes a first pattern surface, a second pattern surface, a third pattern surface, and a fourth pattern surface, and wherein the pattern element protrudes outward from the base circumferential surface to define a distance, Hp, between the first, second, third, and fourth pattern surfaces and the base circumferential surface, and wherein the pattern element is bounded by a perimeter; a first channel in the pattern element, the first channel having a first end portion and a second end portion, the first end portion located on the perimeter; a second channel in the pattern element, the second channel having a first end portion and a second end portion, the first end portion and the second end portion located on the perimeter, wherein the first channel and the second channel cross each other and separate the first, second, third, and fourth pattern surfaces from each other; and wherein the bonding roll is adjacent the anvil roll to define a nip between the first, second, third, and fourth pattern surfaces and the anvil roll; and wherein the bonding roll is biased toward the anvil roll to define a nip pressure from about 40,000 PSI to about 60,000 PSI between the first, second, third, and fourth pattern surfaces and the anvil roll.